Mitsubishi Chemical sets up a new base for special epoxy resins, increasing production capacity by 30%

On December 16, Japan's Mitsubishi Chemical issued an announcement on "Enhancing the Production Capacity of Special Epoxy Resins for Semiconductor Packaging Materials Electronic Materials": Mitsubishi Chemical Corporation (Headquarters: Chiyoda-ku, Tokyo) Kitakyushu, Fukuoka Prefecture) established a new production base for specialty epoxy resins for semiconductor packaging materials and electronic materials
.
Epoxy resins are materials used in a wide range of applications such as coatings, adhesives, and semiconductor sealing materials
.
In particular, our special epoxy resin has excellent properties such as high heat resistance, low low temperature melt viscosity, and low water absorption.
It is adopted as a factory standard for semiconductor sealing materials all over the world, and the semiconductor market will also grow significantly in the future
.

The company currently produces epoxy resins (40,000 tons of production capacity) at the Mie Office (Yokkaichi City, Mie Prefecture).
In order to meet the strong demand and strengthen the supply chain, we decided to set up a new series as follows (Head Office: Kitakyushu City, Fukuoka Prefecture) ) contract production
.
Through this enhancement, the production capacity of the company's semiconductor sealing materials and specialty epoxy resins for electronic materials has been increased by approximately 30%, and commercial production is expected to start in April 2023
.
In the future, in order to strengthen the epoxy business, we will further increase the production capacity
.