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Silicone thermal conductive gels bring new thermal management performance
to smartphonesTaoxi TC-3015 silicone thermal conductive gel from Dow Performance Silicones recently won the "2019 Sustainability Award"
from Business Intelligence Group (BIG).
TaoxiTM TC-3015 silicone thermal conductive gel is a one-component silicone resin material that can be used without mixing; Can be processed in a variety of ways, can be cured quickly at room temperature or through the chip's own heating, without the need for a separate curing process; It can also be exposed to temperatures up to 150°C for faster curing
.
The product has excellent thermal management performance, which can reduce contact resistance better than thermal pads, achieve uniform thermal management and efficient chipset heat dissipation
.
The material does not create hot spots
even when applied to the hottest components on smartphones such as integrated circuits and central processing units.
The product has low adhesion to epoxy resin and metal surfaces, can be pressed down to 100 μm thickness in thermal management applications, and cured into an elastic pad with a certain tensile strength and elongation, enabling easy disassembly and residue-free peeling
of electronic devices during recycling.
