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Issue 14/2017 - High-precision system deployment improves laboratory analysis efficiency

 Last Update: 2022-11-13
 Source: Internet
 Author: User

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Thermo Fisher has announced three new products for semiconductor failure analysis workflows, designed to help semiconductor failure analysis labs process samples and acquire data more efficiently, providing innovative solutions
for semiconductor manufacturers seeking fast, high-quality electrical and physical failure analysis.

The new Helios G4 plasma focused ion beam (FIB) system enables reverse peeling of a wide range of semiconductor devices and provides super-resolution scanning electron microscopy (SEM) analysis
.
The new flexProber nanoprobe metrology system can be used for fast electrical failure analysis applications
.
It accurately locates
the fault location of semiconductor wafers at the interconnect wire and transistor level.
The new Themis S transmission electron microscope (TEM) is used on the most challenging semiconductor devices, providing atomic-level resolution imaging and high-yield elemental analysis
.

In addition, the Themis S system is the latest addition
to Thermo Fisher Fisher's industry-standard Themis family of transmission electron microscopes.
Themis S systems are designed to provide large-scale semiconductor images and analysis data for failure analysis of semiconductor devices up to the 20 nm technology node, while also including an integrated vibration isolation shield and full remote operation capabilities
.

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