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Recently, Solvay's KetaSpire PEEK (polyetheretherketone) has helped Shin-Etsu Polymers successfully develop an ultra-thin high-performance Shin-Etsu Sepla Film film
with a thickness of 3~9 m (0.
11~0.
35 mil).
"KetaSpire PEEK meets the demanding application performance requirements of Shin-Etsu Sepla Film by combining excellent mechanical properties, high temperature resistance, high purity, flame retardancy and outstanding abrasion, friction and aging resistance," said
Mr.
Kazuhiro Kiroko, General Manager of Solvay Specialty Polymers Japan.
Shin-Etsu Sepla Film is widely used as a speaker diaphragm
for smartphones and other mobile devices due to its ability to minimize sound output distortion and facilitate subsequent compounding.
It is also suitable for all kinds of industrial applications, including electrical circuit insulation and enameled wire, automotive parts, electronic circuit boards, aerospace, robotics, medical equipment and other occasions
that require insulation.
High temperature resistance also allows Shin-Etsu Sepla Film to be used as a mask material
for lead-free automatic soldering of electronic products.