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The new high-purity specialty dianhydride powder can be applied to PI film formulations
SABIC has launched an innovative high-purity SD1100P specialty anhydride powder for polyimide (PI) film formulations that will further advance 5G printed circuit boards (PCBs), transparent displays, and other flexible electronics applications
.
This 4,4'-bisphenol A dietherdiedic anhydride (BPADA) powder can help customers design high molecular weight PI formulations that improve the balance
between thermal and mechanical properties.
SABIC's SD1100P bisphenol A type etherdiedic anhydride powder offers a variety of performance advantages over other dianhydride products currently on the market, including lower dielectric constant and loss factor, lower water absorption, and stronger metal adhesion
.
These advantages are essential
for films and varnish products used in flexible circuit boards, overlay films and adhesives.
Brian Rice, Senior Business Manager, SABIC's Additives Division, said: "Unlocking the full potential of 5G networks requires the support of next-generation E&E solutions such as flexible circuit boards to deliver higher performance
in smaller, thinner packages.
With advanced material solutions such as BPADA powders, SABIC supports
innovative activities in the electrical and electronics sector.
”