High performance UV adhesive resin-FSP8394

UV glue is widely used in industrial assembly, daily necessities and medical device manufacturing because of its fast curing speed, energy saving and environmental protection. Especially in LCD manufacturing, optical products manufacturing, mobile phone assembly and other high-end technology areas UV adhesives are increasingly favored, market share is also growing steadily. In high-end applications, there are many test items for UV glue, such as high-temperature and high-humidity resistance,

aging resistance, heat and cold shock resistance, etc. Well-known adhesive manufacturers such as Henco, 3M, Dymax, etc., dominate in some high-end markets, which is not only related to its formulation research and development strength, but also the accumulation of raw materials, a good resin may make the project research and development work more with less effort.
long-term commitment to various types of UV gum resin research and development and application, in recent years has launched a series of products, and constantly improve the product line. For high-end applications, we have previously introduced the FSP8788, a resin with outstanding high temperature and humidity resistance and strength. Based on the synthesis idea of FSP8788, we have recently developed a two-role polyurethane acrylates - FSP8394, the main purpose of which is to further enhance interface adhesion, flexibility and low temperature resistance.
Runo Chemical Technology Center made a series of detailed tests on the resin, the formula uses resin with a small amount of monomer, the appropriate amount of trigger, mainly to investigate the resin curing speed, bonding strength, cohesion, compatible, high temperature and humidity, hot and cold shock and other properties. Through experiments, it can be concluded that FSP8394 has the following characteristics.
High bonding strength
experiments, we tested bonding for different substrates, mainly PC/PC, PC/PVC, PC/glass, glass/glass, glass/aluminum, the test data are shown below. As can be seen from the table, FSP8394 not only has a better bonding strength to the plastic substrate, but also has a better bonding strength to glass and metal. FSP8394 has good adhesion to substrates and wide versatility. In practice, the formulation can be adjusted according to different substrates to further enhance the interface attachment, to obtain excellent bonding strength.
cohesion force
we prepare the FSP8394 into UV glue and inject it into the dumbbell mold, after UV curing, forming a glue strip. A series of test data are obtained by using the puller to carry out the pull test of the glue strip, the results of which are shown in the table below. FSP8394 has a relatively high fracture elongation rate of about 215%, while the cohesion is strong, tensile strength can reach 33MPa, with excellent tenacity. Excellent cohesion forces make the inside of the glue layer less prone to breakage and therefore have excellent bonding fastness.
high temperature and humidity
in high-end applications, high temperature and high humidity performance is one of the most important test indicators. The initial bonding strength of many adhesive resins on the market is very high, however, after boiling or high temperature and humidity testing, its bonding strength has dropped significantly, and even the adhesive layer whitening or directly falling off. In the test, FSP8394 has a water absorption rate of about 1.9%, with a relatively high two-bond conversion rate. Testing 1000h at 85C/85% RH showed no change in the glue layer and a slight decrease in bonding strength. In the test of the performance of boiling water resistance, the glue layer will not appear the phenomenon of fog whitening. These tests show that the FSP8394 has excellent high temperature and humidity resistance and can be used in a wide range of high-end applications.
Soil resistance
some UV glue in the winter temperature drop or in the northern low temperature areas when the use of the film will become hard and brittle, resulting in a decrease in strength, for these low temperature environment applications need to screen the main resin or adjust the formulation structure. FSP8394 Tg is not high, low temperature toughness is good, hot and cold impact test bonding strength did not decrease significantly, can adapt to low temperature environment.
Cure speed
many good toughness, high elongation rate of adhesive resins have the problem of slow curing speed, low cross-link density, if there is an overflow easy to appear dry hair sticky problem. FSP8394 curing speed is fast, in 600mJ/cm2 energy can be dried, has a high double-bond conversion rate, can meet the traditional mercury lamp and LED light source curing requirements, has a very wide construction window.