High-performance UV adhesive resin -FSP8394.

UV glue is widely used in industrial assembly, daily necessities and medical device manufacturing because of its fast curing speed, energy saving and environmental protection. Especially in LCD manufacturing, optical products manufacturing, mobile phone assembly and other high-end technology areas UV adhesives are increasingly favored, market share is also growing steadily. In high-end applications, there are many test items for UV glue, such as high-temperature and high-humidity resistance, aging resistance, heat and cold shock resistance and other performance test standards are very high, for the overall performance of the main resin requirements of . Well-known adhesive manufacturers such as Henco, 3M, Dymax, etc., in some high-end market dominance, not only with its formulation research and development strength, more importantly, the accumulation of raw materials, a good resin may make the project research and development work more with less effort.
long-term commitment to all kinds of UV resin research and development and application, in recent years has launched a series of products, and constantly improve the product line. For high-end applications, we have previously introduced the FSP8788, a resin with outstanding high temperature and humidity resistance and strength. Based on the synthesis idea of FSP8788, we have recently developed a two-role polyurethane acrylates - FSP8394, the main purpose of which is to further enhance interface adhesion, flexibility and low temperature resistance.
Runo Chemical Technology Center made a series of detailed tests on the resin, the formula uses resin with a small amount of monomer, appropriate amount of trigger, mainly to investigate the resin curing speed, bonding strength, cohesion, compatible, high temperature and humidity, hot and cold shock and other properties. Experiments show that FSP8394 has the following characteristics.
A high bonding strength
experiment, we tested bonding for different substrates, mainly PC/PC, PC/PVC, PC/glass, glass/glass, glass/aluminum, the test data are shown below. As can be seen from the table, FSP8394 not only has a better bonding strength to the plastic substrate, but also has a better bonding strength to glass and metal. FSP8394 has good adhesion to substrates and wide versatility. In practice, the formulation can be adjusted according to different substrates to further enhance the interface attachment, to obtain excellent bonding strength.
cohesion force
we prepare FSP8394 into UV glue and inject it into the dumbbell mold, after UV curing, forming a glue strip. A series of test data are obtained by using the puller to carry out the pull test of the glue strip, the results of which are shown in the table below. FSP8394 has a relatively high fracture elongation rate of about 215%, while strong cohesion, tensile strength of up to 33MPa, with excellent tenacity. Excellent cohesion forces make the inside of the adhesive layer less prone to breakage and therefore have excellent bonding fastness.
high temperature and humidity
high temperature and humidity performance is one of the most important test indicators in high- and medium-end applications. Many adhesive resins on the market have a high initial bonding strength, however, after boiling or high temperature and humidity testing, its bonding strength has dropped significantly, and even the adhesive layer whitening or direct shedding. In the test, the water absorption rate of FSP8394 is about 1.9%, which has a relatively high two-key conversion rate. Testing 1000h at 85C/85% RH showed no change in the glue layer and a slight decrease in bonding strength. In the test of the performance of boiling water, the glue layer will not appear the phenomenon of fog whitening. These tests show that the FSP8394 has excellent high temperature and humidity resistance and can be used in a wide range of high-end applications.
Cthere resistance
some UV glue in the winter temperature drop or in the northern low temperature areas, the film will become hard and brittle, resulting in a decrease in strength, for these low temperature environment applications need to screen the main resin or adjust the formulation structure. FSP8394 Tg is not high, low temperature toughness is good, hot and cold shock test bonding strength did not decrease significantly, can adapt to low temperature environment.
Cure speed
many adhesive resins with good toughness and high elongation rate in the market have problems with slow curing speed and low cross-link density, and if there is an overflow of glue, it is easy to have dry hair sticky problems. FSP8394 curing speed is fast, in 600mJ/cm2 energy can be dried, has a high double-bond conversion rate, can meet the traditional mercury lamp and LED light source curing requirements, has a very wide construction window.
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