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Henkel develops ultra-high thermal conductivity gel

 Last Update: 2022-05-16
 Source: Internet
 Author: User

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Henkel Corporation today announced the introduction of its latest thermal interface material (TIM), Bergquist Liqui Form TLF 10000 Condensate, to meet the thermal management needs of increasingly challenging datacom, telecommunications and industrial automation applications.

Henkel said that this silicone material not only has excellent thermal conductivity, but also has good thermal stability, good compatibility with dispensing equipment, and stable viscosity, which can meet many requirements for mass production of high-reliability electronic equipment

The component density and complexity of 5G telecom infrastructure equipment, data center switches, routers, servers, and industrial automation electronics continues to increase

Wayne Eng, Head of Global Market Strategy for Henkel's Communications and Data Center business, said: "Fast data transfer and instant access to information are a necessity for modern life

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