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    Home > Chemicals Industry > Rubber Plastic News > Evonik Farsoon develops high temperature resistant 3D printing materials

    Evonik Farsoon develops high temperature resistant 3D printing materials

    • Last Update: 2022-11-17
    • Source: Internet
    • Author: User
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    Recently, Evonik and Farsoon have cooperated in depth and successfully developed a new type of high temperature resistant 3D printing powder material
    .
    In this cooperation, the two parties have leveraged their respective expertise in the field of 3D printing polymer materials and polymer laser sintering equipment, opening up a market for the industrialization of new high-temperature-resistant 3D printing materials

    .
    At present, Evonik's INFINAM PA 6005 P (polyamide 613) prefabricated high temperature polymer powder material has successfully completed the performance test on Farsoon ST252P and HT403P series equipment

    .
    Both parties are working on developing more new formulations

    .

    Wolfgang Diekmann, Director of Innovation Management for Additive Manufacturing at Evonik, said: “Close cooperation between material manufacturers and device manufacturers is essential to open up new 3D printing applications
    .
    A series of tests have shown that INFINAM PA 6005, which has a melting point of up to 215°C The P material is not only perfectly compatible with Farsoon ST252P and HT403P equipment, but also efficiently recycled

    .

    Wolfgang Diekmann, Director of Innovation Management for Additive Manufacturing at Evonik, said: “Close cooperation between material manufacturers and device manufacturers is essential to open up new 3D printing applications
    .
    A series of tests have shown that INFINAM PA 6005, which has a melting point of up to 215°C The P material is not only perfectly compatible with Farsoon ST252P and HT403P equipment, but also efficiently recycled

    .

    Dirk Simon, General Manager of Farsoon High-Tech Europe and Head of Farsoon's Global Polymer Materials Business, said: "Through this cooperation with Evonik, we are delighted to further advance new applications in the field of high-temperature additive manufacturing, and at the same time provide industry The chemical 3D printing market provides more opportunities
    .
    Farsoon's polymer laser sintering (SLS) equipment is perfectly compatible with Evonik's polymer powder materials, and the polyamide 613 material itself has outstanding properties, which lays the foundation for the market success of customer products.
    a solid foundation

    .

    Dirk Simon, General Manager of Farsoon High-Tech Europe and Head of Farsoon's Global Polymer Materials Business, said: "Through this cooperation with Evonik, we are delighted to further advance new applications in the field of high-temperature additive manufacturing, and at the same time provide industry The chemical 3D printing market provides more opportunities
    .
    Farsoon's polymer laser sintering (SLS) equipment is perfectly compatible with Evonik's polymer powder materials, and the polyamide 613 material itself has outstanding properties, which lays the foundation for the market success of customer products.
    a solid foundation

    .

    It is reported that Evonik INFINAM PA 6005 P belongs to the Evonik polyamide 6 series
    .
    This new polymer powder material has near-round particle morphology and excellent flowability and application characteristics, making it an ideal material for SLS powder bed 3D printing technology

    .
    Currently, this high-temperature material is produced using a proprietary process at Evonik's Marr site in Germany

    .

    It is reported that Evonik INFINAM PA 6005 P belongs to the Evonik polyamide 6 series
    .
    This new polymer powder material has near-round particle morphology and excellent flowability and application characteristics, making it an ideal material for SLS powder bed 3D printing technology

    .
    Currently, this high-temperature material is produced using a proprietary process at Evonik's Marr site in Germany

    .
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