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The hydrolysolytic chlorine and non-hydrolytic chlorine structures in epoxy resins are present at the end of the chain, representing epoxy breakers. In the case of the same molecular weight, high chlorine resin represents more defects after hardening, lower Tg, higher water absorption, etc. These features have different effects on different applications
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such as resins used in civil construction, the chlorine content is similar to the strength of the hardened resin. However, because perchlorine resins are less likely to crystallize, manufacturers prefer to use them. In the field of semiconductor packaging, hydrolyzed chlorine structures, when tested in pressure cookers at high temperatures and pressures, release hydrochloric acid, causing corrosion of electronic wiring. Therefore, semiconductor packaging in particular requires the use of low chlorine epoxy resin.
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