What is high and low temperature testing of semiconductor power chips?

High and low temperature testing of semiconductor power chips can provide users with a controlled thermal cooling, constant temperature uniform field source, and can also be used as a heat source or cold source for direct heating, cooling, auxiliary heating and auxiliary refrigeration, and is used in petrochemical, pharmaceutical and other chemical reaction process control
。 1.
The high and low temperature test of semiconductor power chip adopts a certain process, and the transistors, resistors, capacitors and inductors required in a circuit and wiring are interconnected together, made on a small piece or several small semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit functions; All the components have been structurally integrated into a whole, making electronic components a big step
towards miniaturization, low power consumption, intelligence and high reliability.
Integrated circuit technology includes chip manufacturing technology and design technology, which is mainly reflected in
processing equipment, processing technology, packaging and testing, mass production and design innovation capabilities.
2.
From the perspective of the entire manufacturing process, integrated circuit testing specifically includes design verification in the design stage, process process testing in the wafer manufacturing stage, wafer testing before packaging and finished product testing after packaging, which runs through the whole process of design, manufacturing, packaging and application, and plays an important role
in ensuring chip performance and improving the operation efficiency of the industrial chain.
3.
Also known as laboratory test or characteristic test, it is to verify whether the design is correct before the chip enters mass production, and functional testing and physical verification
are required.
Chip finished product test, integrated circuit post-process dicing, bonding, packaging and aging process will damage part of the circuit, so in the packaging, aging should be in accordance with the test specifications of the circuit performance testing, the purpose is to select qualified finished products, according to the parameters of device performance, while recording the number of devices and the statistical distribution of various parameters; Based on these data and information, the quality management department supervises the quality of the product, and the production management department controls the production of
circuits.
4.
Semiconductor power chip high and low temperature test is a link in the production process of integrated circuits, the main purpose is to ensure that the chip can fully realize the functions and performance indicators specified in the design specifications in the harsh environment, and fully test the chip from all aspects, which can not only judge whether the chip performance meets the standards, whether it can enter the market, but also fully and quantitatively reflect the various indicators
of each chip from the structure, function to electrical characteristics from the detailed data of the test results.