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On December 23rd, Dongswood Technology (601208) announced that it had received the "China Securities Regulatory Commission(CSRC) Administrative Permit Application Acceptance Order" and that the company's non-public issuance of shares still needed to be approved by the CSRC.
It is understood that the company intends to issue 188 million shares in private to raise 800 million yuan for the annual output of 100 million square meters of functional membrane materials industrialization projects, annual output of 5200 tons of high-frequency high-speed printed circuit boards with special resin materials industrialization projects and an annual output of 60,000 tons of special epoxy resin and intermediate projects.
Project Description
1, an annual output of 100 million square meters of functional film material industrialization project
project construction period of 3 years, the project production scale is determined to annual output of functional film material 100 million square meters, the main products are mucous film reduction, OLED process protection film and flexible panel functional tape . The financial internal rate of return (after tax) on project investments is expected to be 62.37 per cent and the payback period (after tax) is 4.46 years.
2, an annual output of 5200 tons of high-frequency high-speed printed circuit board special resin materials project
project construction period of 2 years, the main products of the project are electronic-grade crystalline double Malayamide resin, electronic grade amorphosic double Malayamide resin, low dielectric active ester curing agent resin and low dielectric thermostate polyphenyl ether resin. The project's financial internal rate of return (after tax) is expected to be 43.80% and the payback period (after tax) is 4.6 years.
3, an annual output of 60,000 tons of special epoxy resin and intermediates project
project construction period of 18 months, the project products for bisphenol A epoxy resin, bisphenol F type epoxy resin, bicep duoethylene epoxy resin and other special epoxy resin and resin intermediates. The project's financial internal rate of return (after tax) is expected to be 35.95 per cent and the payback period (after tax) is 4.31 years.
The leading product of the fund-raising investment project is to support the core components or raw materials of OLED display industry, high-frequency high-speed printed circuit board industry, break the pattern of key materials and core technologies in the hands of foreign enterprises such as the United States, Japan and South Korea, and realize import substitution.
Through the implementation of this project, the company actively participated in the construction of the domestic science and technology cycle, in the context of China-U.S. decoupling, seize the "double cycle of new development pattern" brought about by the market opportunities, to help downstream panel display, 5G communications and other key areas of the industrial chain to achieve "autonomous control" and "industrial upgrading", fully realize the company's strategic development goals and performance growth goals.
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