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    Home > Chemicals Industry > China Chemical > Shanghai plans to make every effort to build a future materials industry cluster

    Shanghai plans to make every effort to build a future materials industry cluster

    • Last Update: 2022-10-20
    • Source: Internet
    • Author: User
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    The Shanghai Municipal People's Government recently issued the Action Plan for Shanghai to Build a Future Industrial Innovation Highland and Develop and Expand Future Industrial Clusters, making every effort to build a future industrial innovation highland
    with world influence.

    The goal is that by 2030, Shanghai will emerge a number of hard-core achievements, innovative enterprises and leading talents with world influence in the fields of future health, future intelligence, future energy, future space and future materials, and the future industrial output value will reach about
    500 billion yuan.
    By 2035, a number of future industrial clusters
    will be formed, leading the world.

    In order to achieve the above goals, the Action Plan proposes to lay out future industries and build five future industrial clusters
    such as health, intelligence, energy, space, and materials.

    Shanghai will improve the carrying capacity of industrial transformation in Pudong, Baoshan, Jinshan and other regions, build a future material industry cluster, and focus on the three major fields of
    high-end film materials, high-performance composite materials and non-silicon core materials.

    High-end
    membrane materials.
    Improve the ability of membrane material infrastructure design and raw material autonomy, break through high-end separation membrane technology, and develop raw materials and film-forming technologies
    such as fuel cell proton exchange membranes and special resins, hollow fiber membranes for extracorporeal membrane oxygenators, liquid crystal polymer membranes for 5G/6G antennas, and high thermal conductivity graphene films.
    Continue to promote the iteration and industrialization of
    material technologies such as high-end lithium battery film materials, new display optical films, and integrated circuit release films.

    In terms of
    high-performance composites.
    Strengthen the high-performance fiber industry chain, layout extreme environment fiber, biomedical fiber, artificial intelligence fiber and other directions
    .
    Strengthen the research and development of polyacrylonitrile-based carbon fiber, support the improvement of preparation technology and process of viscose-based carbon fiber, asphalt-based carbon fiber, aramid fiber, ultra-high molecular weight polyolefin fiber, tackle key catalytic materials, and break through the mass production technology
    of high-performance carbon fiber and composite materials.
    Research and development of energy conversion and storage fibers, color-changing fibers, shape memory fibers and actuation fibers
    .
    Continue to tackle technologies
    such as high-temperature alloys, metal matrix composites and high-end medical degradable alloys for aero-engines.

    Non-silicon
    core materials.
    Promote the development of wide bandgap semiconductor compounds such as silicon carbide and gallium nitride, continue to improve the energy level and mass production scale of crystal preparation technology of wide bandgap semiconductor compounds, actively deploy wide bandgap semiconductor wafer manufacturing process technology, enhance wide bandgap semiconductor chip product design capabilities, and expand product application fields
    .
    Actively promote the research and layout
    of future non-silicon-based semiconductor material technologies such as graphene and carbon nanotubes, and semiconductor two-dimensional materials.

    The Action Plan also proposes to build future energy industry clusters
    in Shanghai Pudong, Minhang, Jiading and other regions.
    Focus on advanced nuclear energy, new energy storage and other fields
    .

    To this end, Shanghai will implement six major plans, including the "Foundation Building Plan" for future technologies, the "Leading Plan" for future layout, and the "Hand in Hand Plan" for future partners, to compete for the future track
    .

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