SABIC's LNP™ THERMOCOMP™ compound with LDS properties helps Cicor realize the miniaturization of fine-pitch 3D-MID to meet the needs of 5G application scenarios

The Netherlands, September 2, 2021 - Cicor, a leading manufacturer of printed circuit boards and hybrid circuits, uses SABIC LNP™ THERMOCOMP™ compound with LDS (Laser Direct Structuring) properties for high-end 3D molding Interconnect Devices (3D-MID)
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Chico and SABIC have been cooperating for a long time and have successfully jointly developed precision components for 5G networks, automobiles and consumer electronic products to meet a number of stringent requirements
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SABIC's LNP THERMOCOMP compound products provide excellent flow, optimized LDS performance for thin-walled structures in miniature designs, and help achieve uniform fine-grain thickness in assembly processes using surface mount technology (SMT).
spacing circuit patterns and provides excellent high temperature resistance
.

"SABIC is a leading producer of laser direct structuring functional materials
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In the production process of highly integrated electronic products, the laser direct structuring capability helps to save space in small and thin electronic devices," SABIC Specialty Materials Division LNP and NORYL Zhao Fanli, director of product business management, said
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"With the rapid development of 3D-MID technology, Chico hopes to achieve better performance and higher precision through product design innovation, and SABIC is able to meet the needs of this enterprise
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With material innovation and professional technology, we We have always been committed to helping customers like Chico stay at the forefront of the development trend of electronic products
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"

“We have been continuously investigating the specific application of liquid crystal polymers in fine pitch 3D-MID products
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During this process, we quickly discovered that liquid crystal polymer-based SABIC LNPs are With better performance than similar products, the THERMOCOMP compound was the best solution for our requirements," said HS Song, general manager of Suzhou Chike Electronic Technology Co.
,
Ltd.
“Furthermore, this material can help us increase throughput, thereby reducing overall system costs
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To help us make better use of LNP THERMOCOMP compounds, SABIC offers a number of value-added services including formulation adjustments.

SABIC With superb material knowledge, unparalleled technical strength, and the ability to respond quickly to customer needs, it is a model of outstanding performance
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"

Compared to conventional printed circuit boards, this structure helps save space and weight, as molded interconnects can integrate electrical and mechanical functions into a single 3D component
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With the advancement of 5G infrastructure construction and the implementation of 5G application scenarios, such high-precision micro-devices can help miniaturize systems and meet demanding requirements for high-performance performance
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For example, 5G network coverage in cities requires the construction of numerous, closely spaced cell towers to enable faster data transmission while maintaining invisibility
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SABIC LNP THERMOCOMP compounds with LDS properties play an important role in the design and production of high-end MIDs
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This feature helps manufacturers create fine-pitch devices with narrow (<200 microns) pitches between traces and highly complex patterns
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The SABIC materials used to cast such devices contain laser-activated additives
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This additive helps create conductive traces on the device surface and is metallized using electroless plating techniques
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These grades enable precise and uniform metallization of critical circuit traces
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In addition, they can provide low and stable dielectric constant (Dk) and loss (Df) performance
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Thanks to its excellent flow properties (about 10-100 times higher than other polymers) and dimensional stability, LNP THERMOCOMP compounds can be used to cast thin-walled parts with a thickness of less than 0.
5 mm
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The material's high flow properties also help speed up production
.

Previously, Chico used high-performance semi-crystalline materials to produce MID products
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However, as MID specifications continue to increase, SABIC's LNP THERMOCOMP compounds have unique properties that make them ideal for Chico to meet stringent standards
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Compared with similar products currently on the market, SABIC's LNP THERMOCOMP compounds have better dimensional stability, helping to reduce warpage and improve design accuracy
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Another advantage is that it also offers better high temperature resistance during surface mount than other polymers
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"The solution provided by SABIC meets Chico's requirements for high-performance specialty materials that meet the stringent standards of automotive, telecom and consumer electronics components," said SABIC Specialty Asia Pacific Wang Qin, director of formulation and application development, said
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“These areas require applications in smaller, thinner form factors, combined with multiple functions and high temperature resistance in high temperature operating environments
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Our LNP products help address these challenges, demonstrating a 70-year continuance of The strength of material innovation.

The excellent performance of LNP THERMOCOMP compounds and the trust customers place in SABIC is a testament to this
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”