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    Home > Chemicals Industry > Chemical Technology > Issue 45/2014 - WACKER develops easy-to-apply thermally conductive adhesives for electronics

    Issue 45/2014 - WACKER develops easy-to-apply thermally conductive adhesives for electronics

    • Last Update: 2022-11-13
    • Source: Internet
    • Author: User
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    Wacker has developed a new thermally conductive adhesive for electronics
    .
    The silicone rubber, called SEMICOSIL 975TC, has a high degree of thermal conductivity and excellent fluidity and workability, requiring only a little bonding pressure to form an extremely thin adhesive layer between the contact surfaces, which not only has good adhesion, but also allows the heat sink to obtain the ideal heat dissipation effect
    .
    SEMICOSIL 975TC is suitable as an interface material for thermomechanical connections
    of power electronic components or assemblies.

    SEMICOSIL 975TC is an additive cross-linked silicone rubber capable of curing
    at temperatures of up to 90 degrees Celsius.
    This one-component adhesive is electrically insulating and adheres to substrates
    used in many electronic devices.
    Its most critical performance is its high thermal conductivity, which reaches 4.
    3 watts/m Kelvin (according to ASTM5470).

    Despite the high filler content of the product to ensure thermal conductivity, this silicone rubber is still easy to process
    .

    SEMICOSIL 975TC is a viscous paste-like anti-sagging substance before curing, and the flow properties are obtained under shear forces and can be precisely adjusted
    to the requirements of the processing technology.
    This allows SEMICOSIL?975TC to be easily transferred and in-line coated with a small amount of pressure
    , unlike older products in its class.
    The product does not need to be mixed in advance, and can be taken out
    directly from the packaging drum (drum).

    The rheological flow properties of SEMICOSIL 975TC can also bring processing advantages
    to other processes.
    When laying and pressing electronic components, the coated silicone can adhere to the surface of the substrate without excessive force, and form an extremely thin adhesive layer, the minimum coating thickness (adhesive layer thickness) is between 90~100 microns (availability depends on the interface design).

    (Florian)




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