Issue 41/2015 - New PCM thermal management materials improve thermal conductivity in semiconductor devices

Honeywell Electronic Materials recently introduced the new Honeywell PTM6000 Phase Change Material (PCM).

It is Honeywell's latest thermal interface material (TIM) to improve the thermal conductivity and heat dissipation performance
of advanced semiconductor equipment.

Honeywell's PTM and PCM family of thermal management materials are based on Honeywell's
precision phase change technology and advanced filler technology developed specifically for high-performance electronics.
These leading-edge thermal interface materials direct the thermal energy generated by the chip to the heatsink and then diffuse it into the surrounding environment
.
This important function can not only ensure that the chip works at the appropriate temperature, but also ensure the optimal operation
of the heat dissipation module.

Among them, the PTM6000 is designed for applications that require long-lasting reliability and excellent thermal stability, such as automotive and high-power, high-performance servers
.
The performance and stability of PTM6000 has been proven in various accelerated aging profile tests, including 3,000 hours of heat and baking at 150°C (over 300°F); Thermal cycling between -55°C and 125°C (-67 to 257°F) as well as highly accelerated stress testing (EST test).

The new PTM6000 passes all of the above tests to meet demanding heat dissipation needs such as narrow interface thickness, low thermal resistance (<0.
16°Ccm2/W@2mil), and long-term reliability
.
(Qin Chao)