-
Categories
-
Pharmaceutical Intermediates
-
Active Pharmaceutical Ingredients
-
Food Additives
- Industrial Coatings
- Agrochemicals
- Dyes and Pigments
- Surfactant
- Flavors and Fragrances
- Chemical Reagents
- Catalyst and Auxiliary
- Natural Products
- Inorganic Chemistry
-
Organic Chemistry
-
Biochemical Engineering
- Analytical Chemistry
-
Cosmetic Ingredient
- Water Treatment Chemical
-
Pharmaceutical Intermediates
Promotion
ECHEMI Mall
Wholesale
Weekly Price
Exhibition
News
-
Trade Service
Dow Corning's new
room temperature curing (RTV) black hot melt silicone EA-4600 opens up new space
to improve assembly performance in consumer electronics and other demanding mass-produced products.
EA-4600 hot melt adhesive is a reactive material that can be applied as a liquid adhesive to form an extremely thin adhesive line
with a width of no more than 0.
5mm.
Rapidly cools and cures at room temperature to become a strong, flexible elastic polymer
that bonds to common plastic and metal substrates without priming.
EA-4600 hot melt adhesive can adapt to the working temperature of -40 °C ~ 150 °C, will soften at high temperature, but can return to normal state after cooling
.
Compared with conventional polyurethane hot melt adhesive products, EA-4600 silicone hot melt adhesive contains ultraviolet light markers, which is convenient for automatic ultraviolet light inspection of finished products; It can also be reworked and repainted within 24 hours; When fully cured, EA-4600 hot melt adhesive has excellent chemical, waterproof and dustproof properties, improving the reliability and performance
of high-end electronics.
When designing and assembling smart devices with narrow bezels and other innovative ideas, EA-4600 hot melt adhesive offers narrow bezel bonding, high initial bond strength and strong post-cure adhesion compared to double-sided tapes and conventional heat-curing
adhesives.
In bonding tests of 100 million 0.
8mm narrow bezel smartphone glass covers compared to double-sided tape, Dow Corning's new products improved overall cost optimization by a factor of five.
(Newly produced)