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Evonik's composite solutions at the 2020 China International Composites Industry Technology Exhibition

 Last Update: 2022-08-24
 Source: Internet
 Author: User

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fiber composite

alkalinity high

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Evonik will bring a series of innovative composite materials solutions to the China International Composites Industry Technology Exhibition in Shanghai from September 2 to 4, 2020

The use of lightweight, high-performance resource-saving and environmentally friendly materials can meet various challenges caused by environmental pollution, climate change, and resource scarcity

Xia Filiang, President of Evonik Greater China, said: "As one of the key technologies to meet the challenges of global sustainable development, fiber-reinforced composite materials are of great significance

Lighter weight and better performance

Evonik's composite solutions empower manufacturers in the aerospace, electronics, automotive and other industries to meet the latest design needs of these industries

As a core solution, ROHACELL® polymethacryimide (PMI) structural foam has been used in the composites market for nearly 50 years

Join hands with Tongji Electric Team to explore application prospects

In order to further explore product applications, Evonik has sponsored Tongji Electric Team since 2016

During the exhibition, Evonik will also highlight various epoxy resin solutions, including:

· Epoxy curing agent VESTALITE® S can improve the technical performance and processability of high-performance sheet molding compound (SMC), give products greater design freedom, and meet the structural needs of electric vehicles and lightweight vehicles

· Amine curing agents VESTAMIN® and Ancamine® for epoxy systems can create lighter, safer and more efficient pressure vessels, such as pressure gas tanks, which can reduce weight by 70%

· High-performance epoxy curing agents improve composite fabrication and interfacial bonding
.
Evonik's range of high-performance amine curing agents, catalysts and accelerators can be widely used in infusion technology, filament winding and prepreg
.

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