epoxy curing agent - curing promoter

1, phenol-based curing agents: amine curing agents;2, bps A applicable curing agents: amine curing agents;3, interphenol-based curing agents: amine curing agents;4, DMP-30HY960 i.e2, 4, 6-3 (metformine methyl) phenol applicable curing agents: amines, acids, low molecular weight polyamide curing agents; Molecular-weight polyamide curing agent;6, niobium-based curing agent: acid anhydride, low molecular weight polyamide curing agent;7, pyridine-based metformin applicable curing agent: acidanic curing agent (DY062 gravity 0.895 -0.9 g/cm3 viscosity 25 degrees C 25 degrees C, 10 degrees C flash point 33 to 37 degrees C);8, 2-ethyl-4-methylmedyl applicable curing agent: acid, metacylamine curing agent;9, Three fluoride boron-monoethylamine applicable curing agent: amine curing agent;10, triethylamine applicable curing agent: acid anhydride curing agent;11, fatty amine applicable curing agent: low molecular weight polyamide curing agent;12, Curing agents for metformin: amine curing agents;13, triethanolamine-based curing agents: amine curing agents;14, ethyl thiool-based curing agents: amine curing agents;15, pyridine-based curing agents: amine Curing agents;16, triethyamine-based borate applicable curing agent: amine curing agent; 17, cylkicine applicable curing agent: dicyamine curing agent; 18, salicylic acid metal salt-amine reaction (e.g salicylic acid) Zinc acid-isopropylamine ratio of 2:1, the dosage is 5% of the resin) applicable curing agent: amine curing agent ; 2C6H4 (OH) COOH and H3BO3 (OC6H4COO) 2BH-3H2O matched salicylic acid-borioliate glycol 600 into a 66.2% solution, which not only shortens the gel, curing time, but also increases the heat resistance temperature Suitable curing agent: amine curing agent, solution, the amount of 10% of the resin; 20, benzoyl peroxide applicable curing agent: diaminophenimethyl methane; 21, salanate cobalt applicable curing agent: acid anhydride, the dosage is 1 to 1.5% of the resin