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Recently, 3M launched a new product of hollow glass beads suitable for the 5G field
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The new product is a high-frequency and high-speed (HSHF) resin additive with excellent performance and low signal loss, which can be used in composite materials for 5G equipment and components
3M hollow glass beads suitable for the 5G communication industry can help designers of high frequency and high speed (HSHF) copper clad laminates (CCL) to create smooth and lightweight 5G substrates, and then produce printed circuit boards (PCBs) for 5G wireless communication.
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The new 3M hollow glass beads can also be applied to plastic composite materials for 5G communication products, such as base station components, radomes, and even mobile phone housings
Signal loss and interference are always important challenges in the production of printed circuit boards (PCBs).
The higher signal frequency of 5G networks makes this problem stand out
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The use of 3M hollow glass beads as a resin additive helps engineers to accurately grasp the dielectric properties of copper clad laminate (CCL), reduce transmission loss at high signal frequencies and improve communication reliability
"It has been more than half a century since the birth of 3M hollow glass beads.
Recent innovations have allowed us to design new glass beads for the unique needs of 5G electronic products
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The new 3M hollow glass beads are designed for the 5G communications industry.
